Tiers of War
Andy gives it a good going over.
id Software give the Slayer a hellishly good sendoff.
Beats Intel's OEM design at a similar size.
A few red flags, though.
LGA115x kit for 2005+ models.
Shaves off weight, boosts performance.
Low-profile design for 130W TDP.
Delayed cooler gets new fan design.
Gold-plated R1 up for grabs.
We talk with a Cooler Master PM about how CPU coolers are conceived, designed and tested professionally
Printable models check for fit.
Tweaks 2012's Macho for passive use.
Mid-range Tranquillo alternative.
Special coating a secret sauce.
Borrows tricks from its bigger brothers.
Bee-inspired design for latest heatsinks.
Little and large to launch in June.
Big cooler for high-TDP applications.
Low-cost cooler for high-TDP chips.
Start-up's second product due June.
Ultra-thin TIMs the future of cooling?
Two new coolers to launch this month.
Carbon nanotubes to cool future chips.
Trademarks a-plenty in the R1 heatsink.
Tweaked heatsink with shiny black finish.
April 12 2021 | 14:00
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