Western Digital, Toshiba announce BiCS4 QLC flash
Up to 2.66TB per package.
Gigabit Wi-Fi, new 300-series chipsets, and more.
Still using Arm parts, too.
Continues with the metallic theme.
Claims massive improvements over existing tech.
15 percent performance boost claimed.
Two years later than planned.
Low-power now, enthusiast in January.
New 'optimisation' process bears fruit.
AMD's growth failing to draw close.
First premium chip with integrated modem.
Promises CPUs, GPUs, APUs in 2016.
A shot in the arm for Moore's Law.
Another blow to Moore's Law.
Cannon Lake pushed back, leak claims.
14nm shrink now going smoothly.
New fabric, on-package RAM, performance boost.
Clear focus on low-power products.
Intel increasing its foundry business.
Earnings hit by slowing PC sales.
Uses a hybrid of 14nm and 20nm processes for quick time-to-market.
Qualcomm has become the first of TSMC's 28nm customers to publicly complain of capacity issues.
CEO Paul Otellini has said that Intel has ‘line-of-sight’ on 14nm transistor technology.