Taipei Invention Show 2010

October 4, 2010 // 9:18 a.m.

Tags: #2010 #cooler #cpu-cooler #heatsink #innovation #invention #show #taipei #tec

Companies: #bit-tech

We dropped into Taipei's International Invention Show; an annually held event where East Asian companies (although mostly Taiwanese) come to show off their latest ideas and wares. There's pretty much something for everyone and there was a lot of research projects from country-wide University students as well.

Literally the first thing we noticed as we walked through the door was a CPU heatsink with waterpump, called the Heat Courier, developed by ProLynn technologies.

Addendum: 7th October 2010: Despite an entire conversation on the contrary during the show, ProLynn got in touch with us to inform us that its CPU cooler does not in fact include TEC technology. Instead the cooler just houses a low profile waterpump that pushes the 450ml/min through 3mm ID Teflon tubing to a standard water cooling radiator, as shown below.

Despite having no answer to our initial questions about the air and watercooling competition, the ProLynn team has now explained that it was 'not proper to show the comparative results in such a public occasion'. While this was not the impression we got originally, we respect that a combination of reluctance plus English translation caused a misinterpretation.

The full specification of the Heat Courier are as follows:
  • Product Name: Prolynn Heat Courier
  • Dimensions: 56(L) x 56(W) x 12(H) mm
  • Bearing: Nano Ceramic Bearing
  • Maximum Pump Power: 450 mL/min
  • Rated Voltage: DC 12V
  • Input Current: 350 mA
  • Connector: 3 pin or 4 pin PWM
  • Noise: <25 dBA
  • Life time: 40000 hr (MTBF)
  • Weight: <100g
  • Tube: Dupont. Teflon PFA , O.D 4 x I.D 3 mm
Taipei Invention Show 2010 Integrated watercooling CPU cooler Taipei Invention Show 2010 Integrated watercooling CPU cooler
Click to enlarge

Original Text: What got our attention was the fact it was all powered from the motherboard via a single 4-pin header. Traditionally, TEC's require a ton of amperage to create the Peltier effect of one hot side and one cold side, so to power from the motherboard without blowing out the socket was impressive.

The team claims its extremely low profile cooler can cope with a 130W CPU with just 0.3 amps - the same as a single case fan. Not all that power is used by the TEC either, as the whole thing includes a pump to cool the hot side and push the coolant round a 120mm-fan radiator on the back of the case. The pump is minuscule though, shifting just 450 millilitres a minute through friction reduced PTFE tubing.

However, the team demonstrated that its Heat Courier could cool a 130W TDP LGA1366 CPU to 57C under sustained load, which was some 13C cooler than the Intel reference cooler. When we asked how it compared to industry behemoths such as the Corsair H50, CoolIT Eco ALC or even air coolers such as the Thermaltake Frio or Titan Fenrir though, the ProLynn team were not even aware of them.

The Heat Courier's advantages are in its super low profile and small tubing, but it makes us wonder, how and why a company has gone to the expense and effort to patent the product when it's unaware of its direct competition. As fancy and intriguing as TEC products have always been, we think cost vs performance in a competitive cooler market will keep it out of mass adoption.

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