Advertising giant Google has confirmed that it is forging ahead with the Project Ara modular smartphone concept, and plans to release the first commercially available parts in January 2015.
Google's Project Ara, created by one-time subsidiary Motorola and based on Dave Hakkens' Phonebloks concept, is scheduled to hit the market in January 2015.
Originally developed by Motorola Mobility
based on concept work carried out by Dave Hakkens under the name Phonebloks, Project Ara was acquired by Google when it picked up the Mobility division from Motorola. Although the company would go on to sell the bulk of Motorola Mobility to Lenovo
it kept hold of Project Ara, announcing in February this year commercialisation plans
for the technology.
Project Ara aims to offer the same level of customisation available in the PC world to the smartphone - and, eventually, tablet, markets. The Ara platform uses a central chassis dubbed an Endo, to which component modules are connected via magnets. These modules contain everything from the display to the processor, storage, camera and battery, and can be assembled in almost any combination or pattern. As well as ending the annual phone upgrade cycle - the Endo itself, Google claims, would be good for five to six years - by offering the chance of incremental upgrades, the system would also allow for complete customisation: one Endo may have a high-end processor and high-spec camera, while another opts for a slower processor, no camera and a bigger battery for longer runtime.
Google held its first Project Ara developers' conference this week, and CNET
reports that it offered a timeline to commercialisation: the first Project Ara Endo will be on sale, barring any major setbacks along the way, in January next year for just $50. It will be joined by a range of component modules, although the specification and pricing for these has not yet been confirmed.
Google also outlined fabrication hardware for the modules themselves, developed in conjunction with academic and business partners and taking the form of large-scale 3D printers capable of working with conductive materials. More details on these will be provided at the next conference in July.