Moorestown is on track for 2009/2010

Author: Tim Smalley
Published: 21st August 2008
Comments (6) Stumble
Anand Chandrasekher said that Moorestown is on track for 2009/2010 and shows off silicon for the first time.

Anand Chandrasekher said that Moorestown is on track for 2009/2010 and shows off silicon for the first time.

Anand Chandrasekher, Senior Vice President and General Manager of Intel’s Ultra Mobility Group, said during his keynote that Moorestown is on track for release in the 2009-to-2010 timeframe.

To reinforce this point, Chandrasekher held up the first Moorestown wafer and announced that the first silicon was back from the fab.

He then said that Moorestown would enable Intel to target the mobile communications market with MIDs designed to deliver a rich Internet experience on a device no bigger than a typical smartphone.

Like the current Menlow platform, Moorestown is also based on a 45nm manufacturing process, but Intel has worked hard to reduce idle power consumption by a factor of ten in order to target the much smaller form factors that make up the smartphone market.

The two chips that make up the next-generation MID platform are Lincroft and Langwell—both of which are less than the size of a penny—will sit on a PCB that’s smaller than a credit card. Chandrasekher held up a Moorestown reference PCB to confirm its size – it looks like we’ll start seeing much more interesting MIDs in the 2009/2010 timeframe.

Moorestown is on track for 2009/2010 Moorestown is on track for 2009/2010 Moorestown is on track for 2009/2010
Click to enlarge

Are you excited by the potential that Moorestown could offer MID and smartphone manufacturers? Tell us in the forums.
Quote bowman 21st August 2008, 18:31
I am very excited about Moorestown, although a bit miffed that it's not a 32nm product. It might be good anyway, what with the PCU stuff learned from Nehalem being applied and all.

Did he mention spring IDF specifically, or October IDF in Taiwan for more Moorestown info?
Quote ParaHelix.org 21st August 2008, 19:05
I am not as much of a noob than this question will make me sound like, I promise. Now for the question.
What is the large disk that the guy is holding up the the image on the left? thanks.
Quote bowman 21st August 2008, 19:35
Okay, I just watched the netcast, some sites claimed Spring IDF but he said Taiwan which is in October.
Quote:
Originally Posted by ParaHelix.org
I am not as much of a noob than this question will make me sound like, I promise. Now for the question.
What is the large disk that the guy is holding up the the image on the left? thanks.

That's the wafer, all the little square shaped things are dies (or dice), individual chips.
Quote Beefcake 21st August 2008, 19:35
ParaHelix.org,
That's a 300mm silicon wafer that many hundreds of the Moorestown CPUs are etched onto. It will be cut into individual rectangular dies that will be soldered to PCBs like the one he's holding up in the third image.

Beefcake
Quote ParaHelix.org 23rd August 2008, 16:48
Quote:
Originally Posted by Beefcake
ParaHelix.org,
That's a 300mm silicon wafer that many hundreds of the Moorestown CPUs are etched onto. It will be cut into individual rectangular dies that will be soldered to PCBs like the one he's holding up in the third image.

Beefcake

Thanks for that, so, basically its just a load of CPU's stuck together which would usually be cut into individuals?
Quote r4tch3t 24th August 2008, 06:28
I am not looking forward to this, I have never needed a smart phone and wouldn't really want one (unless it was free)
I have the cheapest phone you can get, it sends messages and makes phone calls and has a calculator.
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