Close up gate shots taken with an electron microscope. Very tiny indeed.
AMD and IBM have joined forces to make something Intel announced six months ago: high-k metal gate transistor technology for their jointly developed 45nm process.
Intel does have the edge with its Halfnium-Oxide based insulator whereas the AMD-IBM combo will continue to use strained silicon technology.
Their 45nm process is highlighted to have a lower current leakage and higher capacitance of transistors, for a lower power usage and improved performance.
Interestingly it's only planned for
second generation 45nm and the first generation 32nm technology processes. Therefore, it seems like AMD's Shanghai core - its first 45nm core, coming next year - will still use traditional manufacturing technologies.
This means Intel will be 12-18 months ahead
at least, when it comes to the introduction of its 45nm technology with similar high-k metal gate technology used for its Penryn family of processors later this year.
When will the size reduction end: can we still achieve 25nm and below come 2010 onwards? Your thoughts are always welcome
in the bit-tech community forums.
From which area of the body?, as they normally differ in thickness.
Lets play Higher or Lower
Inel has merely reinvented the Pentium M.... and now shrinking it.
The transistor is obviously larger than just the gate but it gives you an idea of the ridiculous scale involved.
You're talking nanometers, and human hairs are far far larger still. Remember it's HUNDREDS OF MILLIONS in the space of your fingernail, and you're seeing only part of one in that picture.
Holy crap, that's quite small.
So when they design a processor, without any of the actual "designing it" or making it work, just the shear leg-work, it is the same as sorting and lining up enough smarties to cover 21,000 tennis courts! Wowzer!
Thanks for doing the sums :D
New post below
Yes, and then connecting them in 3-D over 9 layers :D
Cheers,
Xir