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Budget in price, mainstream in aspiration.
PCIe 5.0 with knobs on.
Aims for faster, better SoCs.
Moves away from its traditional ring.
The best of both worlds.
First board with 20Gb/s interconnection.
MXC to be unveiled in September.
Applied Materials claims to have solved the problem of creating sub-20nm interconnects.
Intel has acquired Cray's Gemini and Aries interconnect technology, in a further HPC push.
With another doubling of bandwidth, the PCI-Express 3.0 specification is set to go.
October 14 2021 | 15:04
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