We've picked some of the best projects recently completed in our project log forum.
The Cinderblock of cases.
The line-up includes Red Dead Redemption 2, Assassin's Creed Odyssey and 10 others
Gen2 spec doubles the interface rate.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Spintronics prototype proves concept.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
November 13 2019 | 09:50
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