Time to say goodbye from all of us at bit-tech.net
Welcome challenger. Why not sit down, and play a little game?
Budget in price, mainstream in aspiration.
TSV-based 3D DRAM tech heads to production.
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
October 14 2021 | 15:04
Copyright © 2000 - 2022, bit-tech.net. All rights reserved.