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Welcome challenger. Why not sit down, and play a little game?
Budget in price, mainstream in aspiration.
Up to 2.66TB per package.
Promises an easy route to better SoCs.
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
October 14 2021 | 15:04
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