VIA To Demonstrate Innovative Notebooks and Small Form Factor PCs during CES 2009

January 8, 2009 | 12:24

Companies: #via

VIA redefines PC user experience with stylish desktop, notebook and ultra mobile systems based on the high performance, low power VIA Nano™ processor

Taipei, Taiwan, 7 January 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that it will participate in the annual Lunch@Piero's media event, to be held during CES in Las Vegas on January 8th and 9th.

Attendees will be able to see a host of high performance mini-notes, thin and light notebooks, eco-friendly PCs, and power efficient embedded systems designed for a new digital world where Small is Beautiful, all made possible through VIA's expertise in platform miniaturization.

Recent reports show that notebooks are outshipping desktops for the first time, with mini-notes the fastest growing segment of the mobile market, and VIA will be demonstrating why with a host of exciting new mobile systems based on the VIA Nano processor, as well as VIA C7® processor-based mini-note designs from the Global Mobility Bazaar program, an innovative industry infrastructure program aimed at driving the rapid global adoption of affordable mobile computing devices.

Among the key mobile systems to debut at Piero’s is the new Dr. Mobile FreeStyle 1300n thin and light notebook. Powered by a choice of 1.2GHz and 1.3GHz VIA Nano processors, this stylish new device weighs less than 1.3kg and delivers stunning HD video performance through its superb 11.6” screen.

Also on show will be a variety of small form factor desktops from leading global manufacturers such as Foxconn and Shuttle, which couple a power efficient VIA Nano processor with one of VIA’s highly integrated unified digital media chipsets, and an optional S3 Graphics Chrome™ discrete GPU to deliver an optimized visual computing experience in a low power, space saving form factor.

VIA Embedded, the pioneering division of VIA that brought you Mini-ITX, Nano-ITX and Pico-ITX boards, will showcase the latest ARTiGO builder kit, the A2000 barebone storage system, while an innovative home server set-up based on the touch-screen VIPRO will show how the digital lifestyle in the home is starting to happen.

S3 Graphics will demonstrate the latest HD video and image applications using the all-new Chrome 500 series graphics cards running on a VIA Nano processor-based board, including an innovative application visualizing the future of movie and other HD content streaming.

“Consumers have made it plain that what they want in a notebook or desktop PC is full functionality in a stylish, compact package,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “At this event we want to give media a first look at the range of systems that will be driving the market in 2009.”

Rounding out the Lunch@Piero’s media event, Jeffrey Stephenson will debut his most recent case mod, the highly-acclaimed “Ingraham”, the first to be based on a VIA Nano processor.

More information on the Lunch@Piero's event can be found on the VIA website at:

www.via.com.tw/en/company/events/ces2009/index.jsp

About Lunch@ Events

For the past 23 years, Lunch@ events organized by Pat Meier Associates have brought innovative technology companies and typically more than 300 reporters and industry pundits together for a fine productive working lunch, resulting in print and broadcast coverage that has reached around the world. For more information please go to www.lunchat.com

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
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