VIA takes the wrapping off its new dual-core VIA Nano X2 processor in Las Vegas, brings extended VIA family to the party
Taipei, Taiwan, 6 January 2011 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at the annual Lunch@Piero's media event, to be held during CES in Las Vegas on January 6th and 7th.
Attendees at Piero’s in Las Vegas will be among the very first to see the VIA Nano X2 processor in public, as well a range of devices from the broader VIA family including a variety of USB 3.0 products from VIA Labs, Inc., Android tablets based on the WonderMedia Prizm™ ARM SOC platform, and the latest innovations from the VIA Embedded Division.
“The VIA group offers a comprehensive portfolio of technologies that are enabling exciting new applications and device segments at one end, while pushing the envelope on traditional product segments at the other,” said Richard Brown, Vice President of International Marketing, VIA Technologies, Inc. “Visitors at Piero’s this year can experience an exciting range of products and technologies that underline the broad scope and direction of VIA as we move into 2011.”
Based on the latest 40 nanometer fabrication process, the VIA Nano X2 features two 64-bit high performance cores, delivering optimal computational performance and improved multi-tasking ability within a rigid low power envelope. VIA Nano X2 processors target a range of PC products that include desktop, all-in-one and mobile notebook segments.
As well as the new VIA Nano X2 processor platform, attendees at the Lunch@Peiro’s event will be able to see the latest Android tablet designs powered by the WonderMedia Prizm platform, pioneering the tablet revolution that looks set to gain further momentum throughout 2011.
VIA Labs Inc. will demonstrate their complete portfolio of USB 3.0 SuperSpeed controllers that are set to revolutionize how we create, move and share our data between devices. VIA Labs will also demonstrate the new and exciting applications facilitated by the massively increased data bandwidth of USB 3.0 standards.
VIA Labs Inc. have quickly established a reputation as an industry frontrunner with a complete catalogue of USB 3.0 Host controllers, Hub controllers, SATA and Nand Flash controllers that are quickly being adopted as industry standard bearers.
Exciting power-efficient discrete graphics solutions and small form factor embedded boards from VIA’s Embedded Division will also be on display along side the latest Pico-ITX-based case-mod creation from master craftsman Jeffrey Stephenson.
More information on the Lunch@Piero's event can be found on the VIA website at:
For the past 24 years, Lunch@ events organized by Pat Meier Associates have brought innovative technology companies and typically more than 300 reporters and industry pundits together for a fine productive working lunch, resulting in print and broadcast coverage that has reached around the world.
For more information please go to www.lunchat.com
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw