NXP Showcases Smart, Energy-Efficient Chips at electronica 2010A

November 9, 2010 | 14:28

Companies: #nxp

November 9, 2010 – At electronica 2010 this week, NXP Semiconductors N.V. (Nasdaq: NXPI) will highlight how semiconductors are enabling a new level of energy efficiency across key application areas including lighting, automotive, solar power and power supplies, as well as smart appliances, buildings and homes. NXP is showcasing a selection of its “smarter” chip solutions offering excellent ROI in terms of energy savings (Hall A4, Stand 542).


* “As semiconductors become pervasive in virtually all advanced technologies, they can play a decisive and far-reaching role in enabling energy savings,” said Rick Clemmer, president and CEO, NXP Semiconductors. “At electronica 2010, we will be demonstrating how NXP is bringing High Performance Mixed Signal technologies across critical application areas to drive ‘eco-engineering’ and reduce power consumption significantly.”


* Smart lighting solutions based on GreenChip™ technology
o As incandescent bulbs continue to be phased out across the globe, NXP GreenChip technology is at the heart of energy-efficient lighting alternatives including CFLs and LEDs
o NXP’s CFL driver ICs are designed to help fluorescent lamps behave like familiar incandescent bulbs and win the hearts and minds of consumers
o With GreenChip technology, NXP is delivering CFL solutions that enable the design and production of energy-saving bulbs that consumers actually want, with:
+ Instant switch on
+ Full dimming without flicker
+ Full lifetime potential – up to 15,000 hours
o NXP also contributes to making lamps easily controllable, and now offers a complete hardware and software solution for RF-controlled lighting systems based on the ZigBee specification
* Energy metering chip enabling smarter appliances and smarter buildings
o In the EU, buildings account for 40 percent of energy end use
+ The European Commission will prioritise building efficiency to achieve its energy efficiency goals.
o Intelligent energy metering helps both consumers better monitor energy consumption, while also enabling utility companies to better predict energy requirements and adjust production accordingly
o NXP’s new energy metering chip – the EM773 – makes it easy for designers to integrate energy metering functionality into almost any device – without in-depth knowledge of metrology
o Consumers and industrial users can now monitor energy consumption in real-time, in devices ranging from smart plugs, smart appliances and green consumer electronics, to building sub-meters, industrial sub-meters, and even clusters of rack-mounted servers in the data center
* Reducing standby power of modern home appliances with GreenChip
o Lawrence Berkeley National Laboratory in the US estimates that standby power use in the US accounts for 5 percent of residential electricity use, suggesting that residential customers spend 4 billion US dollars on standby power each year
o In Germany, Netherlands and Japan, standby power comprises 10 to 15 percent of total residential electricity use
o NXP will demonstrate a low-power systems management design which can be used in various major home appliances such as refrigerators and washing machines
o NXP power solutions based on GreenChip technology enable AC/DC power supply designs to deliver high efficiency, a standby level of less than 10 mW, and a very competitive bill of materials (BoM) by minimising external components
* Automotive LED driver ICs that unleash the full benefit of energy-efficient LEDs
o Strategies Unlimited predicts that the automotive Solid State Lighting market will exceed US $1 billion by 2013
o Car makers are attracted to the longevity, styling, faster turn-on times, color options and reduced energy consumption offered by automotive LEDs
o LEDs can reduce fuel and batter consumption in automotive applications by approximately 50 percent compared to incandescent lights (UMTRI, 2008)
o Today, NXP announced the availability of its automotive LED driver ICs that unleash the full potential of LEDs
+ First driver ICs to integrate core functions critical to automotive LED lighting
+ Compact, all-in-one solution requiring few additional components
+ Enables more cost-effective, reliable LED module designs
+ Offers flexibility to cover different car platforms and LED configurations

Roundtable, presentations and panels:

* CEO roundtable – Nov. 9, 2010 – 11:00 am CET – Hall A3, Stand 242
o Speaker: Rick Clemmer, President and CEO, NXP Semiconductors
o Topic: “What have we learned from the crisis?”
o Rick joins other CEOs to discuss and debate major issues facing the semiconductor industry today
* Automotive Conference – Nov. 9, 2010 – 12:00 pm CET – ICM
o Speaker: Lars Reger, Vice President, Automotive Strategy and Business Development, NXP Semiconductors
o Topic: “Driving innovation in a green automotive industry”
o Lars will discuss five examples, including Electric Power Steering (EPS), Start-Stop Systems, Dual Clutch Transmissions, Partial Networking and Telematics
* Embedded Forum – Nov. 9, 2010 – 4:40 pm CET, Hall A6 Middle
o Speaker: Geoff Lees, Vice President and General Manager, Microcontroller Product Line, NXP Semiconductors
o Topic: “An introduction to a new DSC architecture: LPC4000 – Not just another Cortex-M4!”
o Geoff will discuss the NXP LPC4000 family, the world’s first asymmetrical dual-core digital signal controller architecture featuring an ARM® Cortex™-M4 processor, along with a Cortex-M0 peripheral subsystem
* Wireless Congress – Nov. 11, 2010 - 2:00 pm CET – ICM
o Speaker: Bernd Tetyczka, Marketing Manager, NXP Semiconductors
o Topic: “RFID in Electronic Devices”
o Bernd will explain new use cases for RFID in tracing, authentication and configuration management of electronic devices throughout the electronics supply chain


* NXP at electronica 2010
* Energy-efficient light bulbs that consumers actually want to buy
* Go green without the frustration
* NXP energy metering chip
* GreenChip technology driving efficiency in power and lighting
* NXP driving efficiency in automotive

About NXP Semiconductors

NXP Semiconductors N.V. (Nasdaq: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in Europe, the company has approximately 28,000 employees working in more than 25 countries and posted revenue of US$ 3.8 billion in 2009. For more information visit www.nxp.com

Forward-looking Statements

This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward- looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to rectify them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers’ equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and financial condition, and the market price of the notes, could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made; and, except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our filings are available from our Investor Relations department or from the SEC website, www.sec.gov.
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