DFI LANParty Showcases OC Accessories Series in CeBIT 2009

March 11, 2009 | 09:32

Companies: #dfi

Hannover, 2009/03/04, DFI –DFI LANParty unexpectedly announced the thermal peripheral products in CeBIT 2009. The new LANParty family includes the CPU cooler, Northbridge Cooler and “Golden thermal Compound (黃金散熱膏)”.

For many years, LANParty has been a recognized brand among ultra gamers, and it thoroughly understands the importance of “heat dissipation” towards system stability. Therefore, since the beginning of 2009, DFI slowly expanded its range of heat sink and related products. This enabled LANParty to evolve from just being an “ultra overclocking motherboard” brand to becoming a “total O.C. solutions provider”.

At the exhibition, the showcased “Megahalem” series was dubbed the best performing air-cooled heat sink in the market; and “Flame Freezer” effectively increased Northbridge chip’s heat dissipation area. It utilizes the "Golden Heat Sink Compound", which is as expensive as gold, but has unparalleled, market-leading heat conductivity properties, to bring users the most stable overclocking experience.

About Megahalem
1. Dimension: (L)130mm X (W)74mmX (H)158.7mm
2. Weight: 790g
3. Heatpipe: Ø 6mm X 6pcs
4. Suggest Fan: 120mm X 120mm X25mm (800~1200RPM)
5. Air Flow: 57 Cubic feet per minute
6. Cooper base About Flame Freezer
1. Dimension: (L)128mm X (W)88mm X (H)71mm
2. Weight:107g
3. Heatpipe: Ø 6mm X 1
4. Cooper base

About LANParty
DFI manufactures full series high-tech mainboards and products for special platforms to meet the demands of PC market and special application market. We also cooperate with Intel and top chip manufacturers to develop up-to-date chips and mainboards. LanParty is an over-clocking mainboard brand of DFI, which satisfies the customers that require high efficiency with top grade materials and excellent design.

DFI LANParty Showcases OC Accessories Series in CeBIT 2009

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