As if the demonstration of the world’s first 32nm process technology wasn’t enough, Intel has also announced a treasure chest of new products.
Intel, Samsung Electronics and TSMC have collectively agreed to push forwards with plans to move to 450mm wafer production starting in 2012.
Yesterday saw the transistor celebrate its 60th birthday. It's regarded as one of those inventions that truly revolutionised the world and things have come a long way since its inception.
The Institute of Microelectronics in Singapore and flash memory maker, Fujio Masouka, are claiming huge increases in processing power by making processors in 3D.
Here's a handy index of our comprehensive coverage from the Intel Developer Forum Fall 2007 in San Francisco, California. Everything from the keynotes, including Penryn, Nehalem and Larrabee inside.
IDF FALL 07: Otellini talks briefly about Larrabee's capabilities during his keynote.
IDF FALL 07: Intel CEO Paul Otellini unveiled the company's next generation architecture during his keynote this morning. Say hello to Nehalem.
IDF SPRING 2007: Dileep Bhandarker, Director of Advanced Architectures tells bit-tech more juicy details about Nehlaem.
Intel sat down and talked to us about the future of its 45nm processors, Penryn and Nehalem, and the outcome was very surprising indeed!
Today, Intel has announced what it claims is one of the biggest advancements in fundamental transistor design by using dramatically new materials to build the insulating walls and switching gates in its 45nm transistors. We have a look at what you can expect to see...
IDF FALL 06: Gesher, Nehalem, Woodcrest, Woodcrest, Santa Rosa, 65nm, 45nm, 32nm... the list goes on.