Published on 16th February 2009 by
Stuart Andrews & Antony Leather
Originally Posted by NysoO... After you've applied the TIM with the size of a ricegrain in the middle, the only thing you have to do is to clamp down the heatsink and the TIM will automatically spread perfectly in all the grooves. The TIM will be pushed out in the middle and press away all the air creating a nice contact....
Originally Posted by JipaWoah :D And it's not even April first yet...
Seriously just w t f did I just see? I'd love to see some temperature testing, this finger-stuff against the widely applauded rise grain-method...
Originally Posted by NysoOA whole article and we come down to a faulthy method of applying TIM. After you've applied the TIM with the size of a ricegrain in the middle, the only thing you have to do is to clamp down the heatsink and the TIM will automatically spread perfectly in all the grooves. The TIM will be pushed out in the middle and press away all the air creating a nice contact.
If you use the "spread before clamp down"-method you'll have a high risk of trapping air between the CPU and heatsink.
Originally Posted by PookeyheadI've ALWAYS done it this way. This put a small blob in the middle and then apply the HSF is a stupid way of doing it. Whenever I've done that, then removed the heatsink, there are vast areas of the chip without thermal paste on it.
Grain of rice sized amount... spread to an even, thin film with finger. Works everytime.
Originally Posted by Kodethe problem with applying a rice grain amount then just clamping it down is that if you dont do it perfectly the application of the paste wont be right, though im not sure the whole surface needs to be covered though, personally i think its a great article, perhaps the different methods people use and state the pros and cons for them, but applying TIM is always an area newbies are unsure of, so well done bit-tech :)
Originally Posted by PookeyheadOf course it all has to be covered. The larger the area in contact with the heatsink, the greater the thermal transfer from the chip to the HSF. Any areas uncovered are therefore not in good contact with the HSF. The fact that there is no compound on those areas is mute evidence that there is little or no contact between them and the heatsink, therefore reducing the ability to transfer heat from one object (CPU) to another (HSF).
Rudimentary stuff really.
Just ignore the bollox you read on the internet and use your common sense.
Originally Posted by PookeyheadThis put a small blob in the middle and then apply the HSF is a stupid way of doing it...
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