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The Secrets of PC Memory: Part 2
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The Secrets of PC Memory: Part 2
Author:
Ryan J. Leng
Published:
17th December 2007
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1 - Compact DDR Form Factors
2 - DRAM Self-Refreshing Technology
3 - PASR, DPD and Clock Stop modes
4 - DRAM Packaging
5 - BGA Solder Balls Inspection
6 - Stacking Technology and Increasing Capacity
7 - Stacking Technology Continued
8 - DRAM fabrication
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The Secrets of PC Memory: Part 2
In the second part of this series on PC memory technology, Ryan investigates the secrets behind mobile DDR and self-refreshing technologies, power down modes and chip packaging technologies.
http://www.bit-tech.net/hardware/2007/12/17/the_secrets_of_pc_memory_part_2/1
Back to the Article
1 - Compact DDR Form Factors
2 - DRAM Self-Refreshing Technology
3 - PASR, DPD and Clock Stop modes
4 - DRAM Packaging
5 - BGA Solder Balls Inspection
6 - Stacking Technology and Increasing Capacity
7 - Stacking Technology Continued
8 - DRAM fabrication
Comments (12)
Email to a friend
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